Crystal Substrate Bonding Technologies and Algorithms (CRYSTAL)

Bonded single crystal thin film multi-functional materials (electro-optic, acousto-electric, acousto-optic, magneto-optic or multi-ferroic materials) are vital for diverse sensing and communications technologies (integrated quantum, photonic, terahertz [THz], radio frequency [RF], and actuator platforms). Wafer bonding onto compatible substrates is the critical step for integrating single crystal thin films into multi-functional devices and systems. There is currently no method to analytically investigate wafer bonding processes. Brute force experimentation is required for initial process development, and subsequent changes in materials or device parameters necessitate significant additional trial and error, incurring huge costs, prolonging timeframes, thus limiting exploration of .... Read More