Automated High Placement Accuracy Flip-Chip Die Bonder

Posted Date: Jan 30, 2025

Due Date: Feb 13, 2025

Awarded Date: Jan 29, 2025

SetAside Type

Solicitation ID	Solicitation Title	Solicitation Office
1333ND25PNB030043	Automated High Placement Accuracy Flip-Chip Die Bonder
Synopsis
Contract Award Number 1333ND25PNB030043 was made to the following: Contractor Awarded Name: FINETECH Contractor Awarded Unique Entity ID: DL8LPYERW429 Contractor Awarded Address: Mesa, AZ 85210 USA Base and All Options Value (Total Contract Value): $643,110.00 .... Read More
Office Location	Agency Name	Solicitation Base Posting Type
	NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY	AWARD Notice