Automated High Placement Accuracy Flip-Chip Die Bonder
Posted Date:
Oct 15, 2024
Due Date:
Nov 15, 2024
Awarded Date:
No Awarded Date
| SetAside Type | ||
| Solicitation ID | Solicitation Title | Solicitation Office |
| 1333ND24QNB030528 | Automated High Placement Accuracy Flip-Chip Die Bonder | |
| Synopsis | ||
|
Amendment 3: Revised Statement of Requirement After a review of the Government’s minimum requirements, the solicitation is hereby amended. The purpose of this Amendment is two-fold: 1. To incorporate a revised Statement of Requirement dated October 15, 2024. All revisions have been identified in the revised Statement of Requirement in red font. 2. To provide a new quotation due date, which shall be at 12:00pm EST on October 31, 2024. To be considered for award, you must submit a new quotation in response to the revised Statement of .... Read More |
||
| Office Location | Agency Name | Solicitation Base Posting Type |
| NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY | Combined Synopsis/Solicitation | |
| SetAside Type | ||
| Solicitation ID | Solicitation Title | Solicitation Office |
| 1333ND24QNB030528 | Automated High Placement Accuracy Flip-Chip Die Bonder | |
| Synopsis | ||
|
Automated High Placement Accuracy Flip-Chip Die Bonder .... Read More
|
||
| Office Location | Agency Name | Solicitation Base Posting Type |
| NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY | Combined Synopsis/Solicitation | |
| SetAside Type | ||
| Total Small Business Set-Aside (FAR 19.5) | ||
| Solicitation ID | Solicitation Title | Solicitation Office |
| 1333ND24QNB030528 | Automated High Placement Accuracy Flip-Chip Die Bonder | |
| Synopsis | ||
|
Automated High Placement Accuracy Flip-Chip Die Bonder .... Read More
|
||
| Office Location | Agency Name | Solicitation Base Posting Type |
| NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY | Combined Synopsis/Solicitation | |
